Aluminum nitride ceramics are highly thermal conductive, thermal radiative and have a good electrical insulation property. Utilizing this feature, they are used in components for semiconductor manufacturing equipment, substrate materials and fillers, and more as their applications are expanding.
Substrates
Substrates are highly thermal radiative and have a good electrical insulation property, and have the coefficient of thermal expansion with almost the same level as that of Si. They are resistant to thermal shock, rapid heating and cooling.
Components for Semiconductor Manufacturing Equipment
ALN is a well-balanced material for a component of a semiconductor manufacturing equipment with its good thermal shock resistance, plasma resistance and electrical insulation properties, and have the coefficient of thermal expansion with almost the same level as that of Si wafers.
ALN Fillers
ALN Fillers made by sintering micro-powdered ALN at a high temperature with high thermal conductivity are easy to fill into and mixed in various types of resins and water-resistant, and achieve a high level of radiation performance.
